Our Services

Manufacturing

  • Conventional through-hole component technology

  • Surface mount technology

  • BGA (Ball Grid Array)

  • Flex Circuits

  • X-ray Inspection and Microscope Inspection

  • Consignment or turnkey

  • 24 hour, quick turn assemblies

  • Prototype to medium volume production

Engineering Support

  • Circuit Design & Development

  • Component Engineering Support

  • Process Control for high quality and repeatability

  • Design For Testability & Manufacturability (DFTM)

  • Packaging & Enclosure Design

  • Surface Mounted Device (SMD) Conversions

  • Mechanical Design

Rework

Custom Modification

  • Component Replacement

  • PGA, QFP and Dense Connector Replacement

  • BGA Removal, Replacement and Reballing with X-ray Inspection

  • Overnight Services